Description
Basic Product Information
Brand: APPLIED MATERIALS (AMAT)
Product Model: 0190-74401
Product Name: Semiconductor Process Precision Assembly Component
Origin: United States
Overall Dimensions (L × W × H): 350 × 240 × 150 mm (13.78 × 9.45 × 5.91 inches)
Net Weight: 2.1 kg (4.63 lbs)
Warranty Period: 12-month official manufacturer warranty
Product Overview & Core Functions
The APPLIED MATERIALS 0190-74401 is an original factory precision process component exclusively designed for AMAT semiconductor manufacturing equipment. Tailored for high-standard wafer fabrication environments, this component serves as a key structural and process auxiliary part for semiconductor thin-film deposition, plasma processing and vacuum process systems. It undertakes core functions including equipment structural positioning, process environment stabilization, internal component protection and auxiliary gas circuit & circuit matching. With ultra-precise dimensional tolerance, semiconductor-grade clean manufacturing technology and high structural stability, it effectively ensures the operational consistency and process repeatability of semiconductor production equipment, reducing process fluctuation and wafer defective rate during mass production.
APPLIED MATERIALS 0190-74401
Applicable System & Working Principle
This original AMAT component is fully compatible with mainstream Applied Materials semiconductor process platforms, including PVD physical vapor deposition systems, CVD chemical vapor deposition equipment and plasma etching process units. It operates by precisely matching the internal assembly structure of semiconductor equipment, stabilizing the internal working environment of the process chamber, assisting in uniform gas flow distribution and maintaining mechanical structural balance during high-temperature and high-vacuum process operation. As a critical consumable and structural spare part, it supports long-term stable cyclic operation of process equipment and guarantees the high-precision execution of wafer thin-film growth and surface processing procedures.
Core Technical Parameters
Manufacturing Standard: Original AMAT semiconductor factory precision manufacturing specification
Dimensional Tolerance: Ultra-high precision industrial grade tolerance control
Applicable Working Environment: High vacuum, high temperature semiconductor clean workshop
Working Temperature Range: -20°C to +180°C process cyclic temperature adaptation
Cleanliness Grade: Semiconductor ultra-clean process grade, zero particle shedding
Structural Material: High-purity anti-corrosion, high-temperature resistant industrial alloy
Process Adaptability: Compatible with multiple semiconductor process specialty gases
Operational Stability: Long-cycle fatigue resistance, no deformation or failure after repeated assembly
Environmental Resistance: Anti-corrosion, anti-oxidation, vacuum-resistant industrial performance
Environmental Adaptability & Industrial Certification
Storage Temperature Range: -40°C to +85°C
Maximum Tolerable Humidity: 90% Non-Condensing Relative Humidity
Industry Compliance: SEMI S2/S8, CE, RoHS semiconductor industry standard certification
Application Environment: Strictly adapted to Class 100 / Class 1000 semiconductor cleanrooms
Product Advantages
The APPLIED MATERIALS 0190-74401 features 100% original factory matching accuracy, requiring no secondary debugging during installation and replacement. Adopting high-purity special alloy materials and ultra-precision machining technology, it delivers excellent high-temperature resistance, vacuum stability and anti-pollution performance, effectively avoiding process contamination caused by component aging or deformation. The optimized structural design improves equipment operation stability and process uniformity, greatly extending the service life of semiconductor process equipment. Standardized size and assembly interface ensure fast disassembly and replacement, reducing equipment downtime and improving production efficiency for semiconductor manufacturers.
Wide Application Fields
This original AMAT precision component is widely used in core semiconductor manufacturing processes, including wafer thin-film deposition, plasma etching, micro-nano process machining and semiconductor equipment daily maintenance and upgrading. It is universally applicable to integrated circuit manufacturing, chip memory production, semiconductor discrete device processing and high-precision microelectronics manufacturing industries, serving as an indispensable core spare part for high-end semiconductor fabrication equipment.
