Description
The AMAT 0190-07970 is an original ultra-high vacuum (UHV) metal-sealed angle valve exclusively designed for Applied Materials semiconductor wafer processing equipment. As a core gas circuit switching and vacuum maintenance component for semiconductor deposition, etching and thin-film process systems, this valve adopts full metal sealing structure and ultra-clean manufacturing technology. It features zero air leakage rate, ultra-low particle release, excellent high-temperature resistance and long-cycle switching stability. Fully compliant with semiconductor cleanroom and UHV process standards, it supports 24/7 continuous stable operation in high-precision wafer fabrication environments, ensuring extreme vacuum cleanliness and process consistency for critical semiconductor manufacturing procedures.
AMAT 0190-07970
Physical Specifications (Dimension & Weight)
The AMAT 0190-07970 adopts a compact integrated angle valve structure with precision mechanical machining and electrolytic polishing surface treatment. The streamlined valve body design ensures stable gas flow while saving equipment pipeline layout space, delivering outstanding structural rigidity and anti-deformation performance for long-term vacuum operation.
Overall Dimensions (L × W × H): 145 × 95 × 85 mm (5.71 × 3.74 × 3.35 inches)
Net Weight: 1.2 kg (2.64 lbs)
Installation Method: Standard vacuum pipeline flange fixed installation
Valve Body Material: High-purity 316L VIM-VAR stainless steel
Surface Finishing: Electrolytic polishing with Ra ≤ 0.1 μm ultra-smooth finish
Structural Feature: All-metal vacuum sealing, rigid integrated anti-vibration structure
Core Functional & Process Technical Parameters
Engineered with professional vacuum sealing technology and precise mechanical transmission structure, the AMAT 0190-07970 achieves ultra-high vacuum tightness and ultra-clean process performance, fully meeting strict semiconductor UHV process control standards.
Working Vacuum Level: Ultra-high vacuum (UHV) process grade
Leakage Rate: Ultra-low zero-level air leakage for vacuum system stability
Particle Release Volume: ＜0.5 particles/cm² (≥0.1μm) ultra-clean grade
Working Temperature Range: -20°C to +150°C wide temperature process adaptation
Switching Life: Long-cycle mechanical switching durability
Gas Circuit Adaptation: Compatible with semiconductor process specialty gases
Process Stability: No particle shedding, no gas contamination during operation
Interface & System Compatibility Parameters
This vacuum angle valve adopts standardized semiconductor vacuum interface specifications and precise assembly dimensions, realizing seamless docking and perfect matching with original AMAT wafer processing equipment and vacuum pipeline systems.
Connection Interface: Standard UHV vacuum flange interface
Applicable Pipeline System: Semiconductor process vacuum gas circuit system
System Compatibility: Fully original compatible with AMAT deposition and etching equipment
Assembly Precision: High-precision positioning to ensure vacuum fitting tightness
Working Mode: Pneumatic automatic switching & one-way vacuum sealing control
Environmental Adaptability & Industrial Grade Parameters
Optimized for high-standard semiconductor clean workshop and extreme vacuum process environments, the AMAT 0190-07970 features excellent temperature resistance, corrosion resistance and pollution-free performance, adapting to long-term uninterrupted precision process operation.
Long-Term Stable Operating Temperature Range: -20°C to +150°C
Storage Temperature Range: -30°C to +160°C
Maximum Tolerable Humidity: 90% Non-Condensing Relative Humidity
Cleanliness Grade: Semiconductor ultra-clean process grade
Industry Certifications: SEMI S2/S8, CE, RoHS semiconductor industry standard compliance
Environmental Resistance: High-temperature resistant, corrosion-resistant, pollution-free cleanroom performance
Intelligent Safety & Sealing Protection Mechanisms
The valve integrates all-metal sealing structure and multi-layer safety protection design, effectively preventing vacuum leakage, particle pollution and pipeline backflow, ensuring the safe and stable operation of semiconductor ultra-high vacuum processes.
All-Metal Sealing Protection: No rubber aging failure, permanent stable vacuum tightness
Anti-Backflow Protection: One-way valve structure to prevent process gas backflow pollution
High-Temperature Anti-Deformation: Integral rigid structure to avoid sealing failure under high temperature
Ultra-Clean Protection: Electrolytic polishing anti-adhesion design to reduce particle residue
Product Advantages & Application Scenarios
The AMAT 0190-07970 features original factory precise matching performance, all-metal durable sealing and ultra-low particle release advantages. The 316L VIM-VAR high-purity stainless steel material and ultra-smooth electrolytic polishing surface effectively avoid process gas adsorption and particle contamination, greatly improving wafer processing yield. The wide temperature adaptation and long switching life reduce equipment maintenance frequency and downtime loss. The standard vacuum flange design simplifies on-site installation, disassembly and pipeline debugging, perfectly meeting the long-term stable operation requirements of semiconductor ultra-high vacuum processes.
It is widely applicable to Applied Materials semiconductor wafer deposition equipment, plasma etching process systems, ultra-high vacuum pipeline switching control, and cleanroom precision vacuum process support systems. All products undergo strict factory vacuum leakage testing and ultra-clean calibration, equipped with a 12-month official warranty, providing reliable original core vacuum control guarantee for high-precision semiconductor manufacturing systems.
